Company Profile

Owing to the superiority of diamond, the value of wide range of application and the development trend of the future of science and technologies of new materials, in June 2001, Fongso Technologies Co., Ltd. was established in Taichung, Taiwan. In the same time, Fongso Tech set up advisory & consultant team in Silicon Valley, USA. The members of Fongso Tech RD team are composed by a group of professionals in the most advanced diamond material and experienced technological engineers who are long committed to the research and development of a latest diamond wafer. They are expertise on “Thermal Conductivity”, “Surface Acoustic Wave Filter”, “Electrochemical Sensor & Detector”, “Field Emission display by Field Effect”, “Diamond Lapping & Polishing”, and so on. Since the company founded till now, we are already leading far away comparing with the current status of global academic research. We got the world’s first commercial success for a large size of HFCVD diamond wafer production equipment CVD-D vacuum equipment "Fongso 2" and synchronize built complete engineering process and the success of the CVD Diamond Wafer production. We also successfully developed own lapping & polishing machine for CVD Diamond Wafer "Fongso 1", exceed the international standard level and got widely affirmed.

A main product of the company is 4-inch diamond wafer with mirror surface which is suitable for thermal management, communication device, diamond cutting & forming tools, MEMS, medical device, optical device, precision electronics device and other applications. As the world’s first company to develop 4-inch diamond wafer with mirror surface (approximate surface finish 5 nm) successfully, it is real let global academic and industry feel shock and praise. Trust Fongso Tech’s 4-inch diamond wafer with mirror surface (approximate surface finish Ra 5nm) is leading in this industry and will keep the leading position in the future around the world.