FONGSO TECHNOLOGIES. CO.,LTD.

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CVD diamond wafers


Applications

The developing trend of electronic consumer products must be getting compact size. Due to this trend, the circuit components must be designed for high density. Therefore, the heat issue will be a problem to electronic components. Electronic components will be malfunction or damage when the temperature is too high or with rapidly excessive heat. Using Alumina to have heat dissipation can’t increase the power of devices. Using copper to have heat dissipation will absorb too much waste heat to endothermic reaction.

Now, electronic and optoelectronic components power is increased to close the limitation of existing cooling package technology. In order to have power upgrade again in the future, we must solve the heat problem first, so how to choose good heat dissipation material is the key for the IC industry. Today, FongsoTech’s CVD diamond wafer is the ultimate heat spreading material can break through the current heat problems and bottle necks. Trust it will become the mainstream of future cooling materials. There are many applications can be applied to other high-tech industries.

NO. Function Applications Characteristics Future Industry Applications
1 High-temperature semiconductors Vehicles Aeroplane
Control device for Turbine of industrial machine
Control device for Home appliance
Heat-resistance
property
Stable and reliable control at over 100℃
Miniaturization of home appliance
2 Substrate for high frequency / high power devices Microwave wireless
Lan(traffic control, communication in office environment, multiplex TV)
High speed transistor
High-speed data communication
Non-contact entry door management
High dielectric strength(withstanding voltage)
High carrier drift mobility and saturation velocity
High-spped, high-capacity data communication
Optimization of traffic and entry
Microwave amplifying device with GHz band
3 High-dielectric strength semiconductor Power control High breakdown voltage Miniaturization of device
4 Electronic emission Flat panel display Negatively electron affinity Low power consumption of display
5 Luminescence Luminescence and laser from blue light to UV
White light emitting
Light source of printer
Wide band gap Large capacity optical recording
Large size display
Miniaturization of printer
6 Radiation detection Digital X-ray image recorded
Control of nuclear reactor
Radiation resistance Enhancement of roentgenology
Maintenance of nuclear power generation
7 Optical detection Fire detection
UV monitor
Wide band gap Early detection of disaster
Monitor of Global environment
8 Strain and pressure sensing Super-sensitivity strain gauge and pressure sensor
Strain gauge and pressure sensor with heat-resisting property
Piezospecific resistance
Heat-resisting property
Super-sensitivity detector for industrial device
9 Temperature detection Temperature sensor with super-sensitivity and radiation resistance Wide band gap Optimum combustion control of vehicle
Maintenance of nuclear reactor
10 Magnetic field detection Super-sensitivity magnetic field sensor
Rotation detection of vehicle, aeroplane, turbine
Magneto-resistance effect Optimum control of rotator
11 Window of x-ray mask of photolithograph High luminous transmittance Manufacture of sub-micron LSI
12 Window of infrared ray Window of infrared ray High luminous transmittance Monitor of global environment
13 Thermal diffusion Heat sink High thermal conductivity Improvement of reliability for microwave module


CVD diamond wafer

Fongso Technologies : 4-inch CVD Diamond Film on Si Substrate as non-polish

 

Fongso Technologies : 4-inch CVD Diamond Film on si substrate as mirror polish (Surface finish Ra 1.052nm Rq 1.321nm)

 

Fongso Technologies : SEM image of 4-inch CVD Diamond Wafer Surface as non-polish (Magnification : 1,000 times)

 

Fongso Technologies : SEM image of 4-inch CVD Diamond Wafer Surface as non-polish (Magnification : 2,000 times)

 

Fongso Technologies : SEM image of 4-inch CVD Diamond Wafer Surface as non-polish (Magnification :7,000 times)

 

Fongso Technologies : SEM image of 4-inch CVD Diamond Wafer cross-section as non-polish

 

Fongso Technologies : SEM image of 4-inch CVD Diamond Wafer cross-section as mirror-polish (surface finish Ra 1.052nm Rq 1.321)

 

Fongso Technologies : Raman scattering spectrum of 4-inch CVD Diamond Film

 

Fongso Technologies : 4-inch CVD Diamond Wafers

 

Fongso Technologies : 4-inch CVD Diamond Wafers

 

Fongso Technologies : 4-inch CVD Diamond Wafers

 

Fongso Technologies : 4-inch CVD Diamond Wafers as mirror polish

 

Fongso Technologies : 4-inch CVD Diamond Wafers as mirror polish

 

Fongso Technologies : 4-inch CVD Diamond Wafers as mirror polish

 

Fongso Technologies : 4-inch CVD Diamond Wafers as mirror polish