CVD鑽石薄膜應用
摻硼鑽石電極
BDD Electrode
絕緣閘雙極性電晶體(IGBT)
Insulated Gate Bipolar Transistor
CVD鑽石工具和UPC工具
CVD Diamond tool & UPC tool
AMF & STM的描畫針
Stylus for AMF & STM
光學機器的X射線視窗
Optical device X-ray window
高敏感的半導體傳感器
High sensitive semiconductor sensor
TAB tool
TAB工具
Bonding tool of semiconductor process bears high temperature (400 ~ 600℃) and repeatable load. And then the material of contact surface is required high resistance thermal property, high resistance wearing, inert property and high thermal conductivity(1).
CVD diamod bonding tools are widly used for TAB (Taped Automated Bonding), COF (Chip on Film), COG (Chip in Glass) and FC (Flipchip) processor of drive IC packages for LCD or PDP.
TAB tool
(Sumitomo Electric Hardmetal Co products)
Application
TAB, COF, COG and FC for LCD or PDP
World market
Diamond & CBM tool: 50 billion JPY(1) (2006)
Reference
(1) Asahi Diamond Industrial Co.