CVD diamond wafer applications

摻硼鑽石電極
Boron-doped diamond electrodes
Boron-doped diamond wafer as electrode of sewage treatment equipment

絕緣閘雙極性電晶體(IGBT)
Insulated Gate Bipolar Transistor (IGBT)
IGBT EV

發光二極體
Light Emitting Diode

液晶顯示器
Liquid Crystal Display

太陽能電池
Solar Cell

太陽熱能發電
Solar thermal energy

表面聲波濾波器
SAW filter

半導體二極體和電晶體
Cmos

TAB工具
TAB tool

CVD鑽石工具和UPC工具
CVD Diamond tool & UPC tool

AMF & STM的描畫針
Stylus for AMF & STM

光學機器的X射線視窗
Optical device X-ray window

高敏感的半導體傳感器
High sensitive semiconductor sensor

擴音器的高頻揚聲器
Tweeter for Speaker

抗磨損的機械部分
Mechanical parts

半導體的平版印刷遮蔽物
Lithograph mask

TAB tool

TAB工具
Bonding tool of semiconductor process bears high temperature (400 ~ 600℃) and repeatable load. And then the material of contact surface is required high resistance thermal property, high resistance wearing, inert property and high thermal conductivity(1). CVD diamod bonding tools are widly used for TAB (Taped Automated Bonding), COF (Chip on Film), COG (Chip in Glass) and FC (Flipchip) processor of drive IC packages for LCD or PDP.

TAB tool
(Sumitomo Electric Hardmetal Co products)

Application
TAB, COF, COG and FC for LCD or PDP
World market
Diamond & CBM tool: 50 billion JPY(1) (2006)
Reference
(1) Asahi Diamond Industrial Co.